Bonding Wire

K&S offers the industry's most comprehensive range of bonding wire and ribbon products to meet virtually any IC interconnection need. Whether your applications involve the advanced ball or wedge bonding, or wafer/stud bumping, we offer a wide array of materials, diameters, properties and packaging to suit your most challenging specifications.

New!  AW66i & AW99i

• Engineered for Superior Looping Results in all Stacked Die Applications.

High Performance Gold Wire High Tensile Strength 4N & 2N Wire	RADIX™ Series Gold Wire Ultimate intermetallic stability	Stud Bumping Gold Wire For all types of bumping applications
Wedge Bonding Gold Wire For consistent low loop profiles	Aluminum Bonding Wire Choose heavy or fine aluminum wire	Formax™ Gold Wire For Stacked Die and Multi-tier Applications
Copper Bonding Wire A viable alternative to gold wire	Specialty Products Bonding ribbon & custom products