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Process Technologies DIE BONDER IMagen Dicing Blades Bonding Tools Bonding Wire

About K&S Bonding Wire Wire Characteristics Wire Packaging Bonding Wire Catalog High Performance Gold Wire RADIX™ Gold Wire Stud Bumping Gold Wire Wedge Bonding Gold Wire Aluminum Wire Formax™ Gold Wire Copper Wire Specialty Products Wire Datasheets (Au) Wire Datasheets (Al/Cu)

Wire Bonders/ automatic Wire Bonders/ manual Stud Bumpers K&S Terms and Conditions Inquiry Form

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Proper Handling of Bonding Wire (English & Mandarin) Utilise Gold: Industrial Gold Products, Materials & Chemicals

Bonding Wire

K&S offers the industry's most comprehensive range of bonding wire and ribbon products to meet virtually any IC interconnection need. Whether your applications involve the advanced ball or wedge bonding, or wafer/stud bumping, we offer a wide array of materials, diameters, properties and packaging to suit your most challenging specifications.

New! AW66i & AW99i

Engineered for Superior Looping Results in all Stacked Die Applications.

RADIX™ Series Gold Wire
Ultimate intermetallic stability

Formax™ Gold Wire
For Stacked Die and Multi-tier Applications

High Performance Gold Wire
High Tensile Strength 4N & 2N Wire

Wedge Bonding Gold Wire
For consistent low loop profiles

Stud Bumping Gold Wire
For all types of bumping applications

Aluminum Bonding Wire
Choose heavy or fine aluminum wire

Copper Bonding Wire
A viable alternative to gold wire

Specialty Products
Bonding ribbon & custom products

WirePRO Online Wire Configurator
Find the best wire for your application

Contact K&S Sales
Find a local sales office

Fine wire for the semiconductor industry